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Dynamic Behavior of Bubble Interface During Boiling

X.F.Peng Z.Wang D.J.Lee

热科学学报:英文版Issue(4):P.308-319,12.
热科学学报:英文版Issue(4):P.308-319,12.

Dynamic Behavior of Bubble Interface During Boiling

X.F.Peng 1Z.Wang 2D.J.Lee3

作者信息

  • 1. Department of Thermal Engineering
  • 2. Tsinghua University
  • 3. Department of Chemical Engineering
  • 折叠

摘要

关键词

boiling interfacial phenomena transport process phase change bubble.

分类

能源科技

引用本文复制引用

X.F.Peng,Z.Wang,D.J.Lee..Dynamic Behavior of Bubble Interface During Boiling[J].热科学学报:英文版,2002,(4):P.308-319,12.

基金项目

This work was currently supported by the National Natural Science Foundation of China through Contracts No. 59625612 and 59976016. ()

热科学学报:英文版

OASCI

1003-2169

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