半导体学报（英文版）2021，Vol.42Issue(2)：16-18,3.DOI:10.1088/1674-4926/42/2/020101
Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration
Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration
Yue Hao 1Huaqiang Wu 2Yuchao Yang 3Qi Liu 4Xiao Gong 5Genquan Han 1Ming Li6
作者信息
- 1. School of Microelectronics,Xidian University,Xi'an 710071,China
- 2. Institute of Microelectronics,Tsinghua University,Beijing 100084,China
- 3. Department of Micro/nanoelectronics,Peking University,Beijing 100871,China
- 4. Frontier Institute of Chip and System,Fudan University,Shanghai 200438,China
- 5. Department of Electrical and Computer Engineering,National University of Singapore,Singapore 117546,Singapore
- 6. Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China
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Yue Hao,Huaqiang Wu,Yuchao Yang,Qi Liu,Xiao Gong,Genquan Han,Ming Li..Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration[J].半导体学报（英文版）,2021,42(2):16-18,3.
