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界面电荷快速转移提升铜修饰氧化钨光催化性能

熊金艳 罗强 赵凯 张梦梦 韩朝 程刚

无机材料学报2021,Vol.36Issue(3):325-331,7.
无机材料学报2021,Vol.36Issue(3):325-331,7.DOI:10.15541/jim20200116

界面电荷快速转移提升铜修饰氧化钨光催化性能

Facilely Anchoring Cu nanoparticles on WO3 Nanocubes for Enhanced Photocatalysis through Efficient Interface Charge Transfer

熊金艳 1罗强 2赵凯 3张梦梦 2韩朝 4程刚2

作者信息

  • 1. 武汉纺织大学 化学与化工学院, 武汉 430073
  • 2. 武汉工程大学 化学与环境工程学院, 武汉 430073
  • 3. 佛山科学技术学院 材料科学与氢能学院, 佛山 528000
  • 4. 伍伦贡大学 超导与电子材料研究所, 新南威尔士 2500, 澳大利亚
  • 折叠

摘要

Abstract

Non-noble metal decoration is a promising strategy for promoting semiconductor photocatalysis by effectively enhancing charge separation. Cube-like WO3-Cu hybrid was successfully synthesized by a facile ascorbic acid reduction method at room temperature. The composition and morphology characterization showed that the Cu particle was deposited on the surface of WO3 nanocube. The WO3-Cu-1.0 hybrid (when 1.0 mmol CuSO4·5H2O was involved into the reaction system) exhibited promoted photocatalytic capability towards Congo Red photodegradation under simulated sun light irradiation. The trapping experiments of active species during photocatalysis and ESR spectra of DMPO?OH signal of WO3-Cu-1.0 composite confirmed that the photogenerated holes (h+), ?OH, and ?O2- were the predominant active species during Conge Red degradation. Based on the photo/electro-chemical measure-ments, it was proposed that efficient charge transfer was accomplished between the WO3 nanocube and Cu nano-particles, which promoted electron-holes separation and subsequently photocatalysis reaction in the Congo Red solution. This work provides a facile preparation method for a binary photocatalyst system in which a semiconductor coupled with non-noble metal.

关键词

半导体/金属复合材料/WO3-Cu纳米复合材料/污染物降解/光催化

Key words

semiconductors/metallic composites/WO3-Cu nanocomposites/pollutants degradation/photocatalysis

分类

通用工业技术

引用本文复制引用

熊金艳,罗强,赵凯,张梦梦,韩朝,程刚..界面电荷快速转移提升铜修饰氧化钨光催化性能[J].无机材料学报,2021,36(3):325-331,7.

基金项目

Hubei Provincial Natural Science Foundation(2019CFB386)湖北省自然科学基金(2019CFB386) (2019CFB386)

无机材料学报

OA北大核心CSCDCSTPCDSCI

1000-324X

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