东南大学学报（英文版）2021，Vol.37Issue(1)：8-13,6.DOI:10.3969/j.issn.1003-7985.2021.01.002
基于硅转接板工艺的宽带射频芯片三维异构集成
3D heterogeneous integration of wideband RF chips using silicon-based adapter board technology
王勇 1韦炜 2杨栋 2孙彪 3张兴稳 2张有明 2黄风义4
作者信息
- 1. 东南大学信息科学与工程学院,南京210096
- 2. 扬州船用电子仪器研究所,扬州225001
- 3. 河北半导体研究所,石家庄050002
- 4. 东南大学网络空间安全学院,南京210096
- 折叠
摘要
Abstract
An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm ×8 mm × 1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.关键词
硅基转接板/混频/倍频/多功能芯片Key words
silicon-based adapter board/frequency mixing/frequency multiplier/multi-function chip分类
信息技术与安全科学引用本文复制引用
王勇,韦炜,杨栋,孙彪,张兴稳,张有明,黄风义..基于硅转接板工艺的宽带射频芯片三维异构集成[J].东南大学学报（英文版）,2021,37(1):8-13,6.
