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Thermal Stress and Assembling Parameters Evolution of CMC Bolted Joint under Transient Thermal Loads

Shuyuan Zhao Zhengyu Li Zeliang Pu Xinyang Sun Wenjiao Zhang

哈尔滨工业大学学报（英文版）2021，Vol.28Issue(3)：1-8,8.

哈尔滨工业大学学报（英文版）2021，Vol.28Issue(3)：1-8,8.DOI:10.11916/j.issn.1005-9113.2019038

Thermal Stress and Assembling Parameters Evolution of CMC Bolted Joint under Transient Thermal Loads

Shuyuan Zhao ¹Zhengyu Li ¹Zeliang Pu ¹Xinyang Sun ²Wenjiao Zhang³

作者信息

1. National Key Laboratory of Science and Technology for National Defense on Advanced Composites in Special Environments,Harbin Institute of Technology,Harbin 150080,China
2. School of Aeronautics and Astronautics,Harbin Institute of Technology,Harbin 150001,China
3. Engineering College,Northeast Agricultural University,Harbin 150030,China
折叠

摘要

关键词

ceramic matrix composite/heat transfer/thermal stress/pre-load/bolt-hole clearance

Key words

ceramic matrix composite/heat transfer/thermal stress/pre-load/bolt-hole clearance

分类

航空航天

引用本文复制引用

Shuyuan Zhao,Zhengyu Li,Zeliang Pu,Xinyang Sun,Wenjiao Zhang..Thermal Stress and Assembling Parameters Evolution of CMC Bolted Joint under Transient Thermal Loads[J].哈尔滨工业大学学报（英文版）,2021,28(3):1-8,8.

基金项目

Sponsored by the Pre-research Foundation of Shenyang Aircraft Design and Research Institute,Aviation Industry Corporation of China(Grant No.JH20128255). （Grant No.JH20128255）

哈尔滨工业大学学报（英文版）

ISSN：1005-9113

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