哈尔滨工业大学学报（英文版）2022，Vol.29Issue(1)：57-63,7.
Preliminary Investigation of Copper Joints Soldered with Sn58Bi
Preliminary Investigation of Copper Joints Soldered with Sn58Bi
Amares Singh 1Teow Sinn Khai 2Rajkumar Durairaj 1Amer Ahmed Qassem Saleh2
作者信息
- 1. Center for Advanced Materials Research and Manufacturing Processes,SEGi University,Petaling Jaya 47810,Selangor,Malaysia
- 2. Lee Kong Chian Faculty of Engineering and Science,University Tunku Abdul Rahman,Kajang 43000,Selangor,Malaysia
- 折叠
摘要
关键词
SnBi solder/low temperature/shear strength/contact angleKey words
SnBi solder/low temperature/shear strength/contact angle分类
矿业与冶金引用本文复制引用
Amares Singh,Teow Sinn Khai,Rajkumar Durairaj,Amer Ahmed Qassem Saleh..Preliminary Investigation of Copper Joints Soldered with Sn58Bi[J].哈尔滨工业大学学报（英文版）,2022,29(1):57-63,7.
