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All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

Ting LIANG Wangwang LI Cheng LEI Yongwei LI Zhiqiang LI Jijun XIONG

光子传感器（英文版）2022，Vol.12Issue(2)：130-139,10.

光子传感器（英文版）2022，Vol.12Issue(2)：130-139,10.DOI:10.1007/s13320-021-0640-7

All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing

Ting LIANG ¹Wangwang LI ²Cheng LEI ³Yongwei LI ¹Zhiqiang LI ¹Jijun XIONG¹

作者信息

1. Science and Technology on Electronic Test & Measurement Laboratory,North University of China,Taiyuan 030051,China
2. Department of Physics,Taiyuan Normal University,Jinzhong 030619,China
3. Institute of Computational and Applied Physics,Taiyuan Normal University,Jinzhong 030619,China
折叠

摘要

关键词

SiC/pressure sensor/optical-fiber/high temperature/direct bonding

Key words

SiC/pressure sensor/optical-fiber/high temperature/direct bonding

引用本文复制引用

Ting LIANG,Wangwang LI,Cheng LEI,Yongwei LI,Zhiqiang LI,Jijun XIONG..All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing[J].光子传感器（英文版）,2022,12(2):130-139,10.

基金项目

This work was supported by the National Natural Science Foundation of China (Grant No.51935011),the fund for Shanxi "1331 Project" Key Subject Construction,Shanxi Natural Science Foundation (Grant Nos.201801D121157 and 201801D221203),and Scientific and Technological Innovation Programs of Higher Education Institutions in Shanxi (Grant No.1810600108MZ). （Grant No.51935011）

光子传感器（英文版）

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ISSN：1674-9251

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