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Molecular Dynamics Simulation on Friction and Thermal Properties of FCC Copper in Nanoscale Sliding Contacts

Ruiting Tong Bin Han Tao Zhang Zefen Quan Geng Liu

哈尔滨工业大学学报:英文版2022,Vol.29Issue(2):P.1-10,10.
哈尔滨工业大学学报:英文版2022,Vol.29Issue(2):P.1-10,10.DOI:10.11916/j.issn.1005-9113.21040

Molecular Dynamics Simulation on Friction and Thermal Properties of FCC Copper in Nanoscale Sliding Contacts

Ruiting Tong 1Bin Han 1Tao Zhang 1Zefen Quan 1Geng Liu1

作者信息

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摘要

关键词

molecular dynamics/friction property/thermal property/nanoscale sliding contact

分类

机械制造

引用本文复制引用

Ruiting Tong,Bin Han,Tao Zhang,Zefen Quan,Geng Liu..Molecular Dynamics Simulation on Friction and Thermal Properties of FCC Copper in Nanoscale Sliding Contacts[J].哈尔滨工业大学学报:英文版,2022,29(2):P.1-10,10.

基金项目

Sponsored by the National Natural Science Foundation of China(Grant Nos.52075444,51675429) (Grant Nos.52075444,51675429)

the Key Project of National Natural Science Foundation of China(Grant No.51535009) (Grant No.51535009)

the Fundamental Research Funds for the Central Universities(Grant No.31020190503004). (Grant No.31020190503004)

哈尔滨工业大学学报:英文版

1005-9113

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