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A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

GONG Tingrui GAO Lei WU Yongjia TAN Haoshu QIN Feng XIN Xiong SHEN Limei LI Juntao MING Tingzhen

热科学学报（英文版）2022，Vol.31Issue(3)：712-726,15.

A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

GONG Tingrui ¹GAO Lei ²WU Yongjia ¹TAN Haoshu ²QIN Feng ³XIN Xiong ¹SHEN Limei ²LI Juntao ¹MING Tingzhen²

作者信息

1. Microsystem&Terahertz Research Center,China Academy of Engineering Physics,Chengdu 610200,China
2. Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621999,China
3. School of Civil Engineering and Architecture,Wuhan University of Technology,Wuhan 430070,China
折叠

摘要

关键词

thermoelectric cooler/thermodynamic model/Thomson effect/contact resistance/device-level performance

Key words

thermoelectric cooler/thermodynamic model/Thomson effect/contact resistance/device-level performance

引用本文复制引用

GONG Tingrui,GAO Lei,WU Yongjia,TAN Haoshu,QIN Feng,XIN Xiong,SHEN Limei,LI Juntao,MING Tingzhen..A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered[J].热科学学报（英文版）,2022,31(3):712-726,15.

基金项目

This study was financially supported by the National Natural Science Foundation of China(NSFC)(Grant No.52106032),the Science Challenge Program(Grant No.TZ2018003),the National Natural Science Foundation of China(Grant No.51778511),the Hubei Provincial Natural Science Foundation of China(Grant No.2018CFA029),and the Key Project of ESI Discipline Development of Wuhan University of Technology(WUT Grant No.2017001). （NSFC）

热科学学报（英文版）

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ISSN：1003-2169

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