半导体学报（英文版）2022，Vol.43Issue(7)：9-55,47.DOI:10.1088/1674-4926/43/7/071401
Trending IC design directions in 2022
Trending IC design directions in 2022
Chi-Hang Chan 1Xihao Liu 2Xun Liu 3Yongpan Liu 4Yan Lu 1Kaiming Nie 5Dongfang Pan 6Nan Qi 7Sai-Weng Sin 1Nan Sun 4Wenyu Sun 4Lin Cheng 6Jiangtao Xu 5Jinshan Yue 4Milin Zhang 4Zhao Zhang 7Wei Deng 4Peng Feng 7Li Geng 2Mo Huang 1Haikun Jia 4Lu Jie 4Ka-Meng Lei1
作者信息
- 1. University of Macau,Macau 999078,China
- 2. Xi'an Jiaotong University,Xi'an 710049,China
- 3. Chinese University of Hong Kong,Shenzhen 518172,China
- 4. Tsinghua University,Beijing 100084,China
- 5. Tianjin University,Tianjin 300072,China
- 6. University of Science and Technology of China,Hefei 230026,China
- 7. Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China
- 折叠
摘要
关键词
integrated circuit design/artificial intelligence(AI)/radio frequency(RF)circuits/data converters/power manage-ment/imager/sensor/cryogenic/biomedicalKey words
integrated circuit design/artificial intelligence(AI)/radio frequency(RF)circuits/data converters/power manage-ment/imager/sensor/cryogenic/biomedical引用本文复制引用
Chi-Hang Chan,Xihao Liu,Xun Liu,Yongpan Liu,Yan Lu,Kaiming Nie,Dongfang Pan,Nan Qi,Sai-Weng Sin,Nan Sun,Wenyu Sun,Lin Cheng,Jiangtao Xu,Jinshan Yue,Milin Zhang,Zhao Zhang,Wei Deng,Peng Feng,Li Geng,Mo Huang,Haikun Jia,Lu Jie,Ka-Meng Lei..Trending IC design directions in 2022[J].半导体学报（英文版）,2022,43(7):9-55,47.
