Integration of high-performance spin-orbit torque MRAM devices by 200-mm-wafer manufacturing platform
Hongchao Zhang Xiangyue Ma Chuanpeng Jiang Jialiang Yin Shuqin Lyu Shiyang Lu Xiantao Shang Bowen Man Cong Zhang Dandan Li Shuhui Li Wenjing Chen Hongxi Liu Gefei Wang Kaihua Cao Zhaohao Wang Weisheng Zhao
半导体学报:英文版2022,Vol.43Issue(10):P.64-72,9.
半导体学报:英文版2022,Vol.43Issue(10):P.64-72,9.DOI:10.1088/1674-4926/43/10/102501
Integration of high-performance spin-orbit torque MRAM devices by 200-mm-wafer manufacturing platform
摘要
关键词
SOT MTJ/low switching current densities/200-mm-wafer platform/endurance/data retention分类
信息技术与安全科学引用本文复制引用
Hongchao Zhang,Xiangyue Ma,Chuanpeng Jiang,Jialiang Yin,Shuqin Lyu,Shiyang Lu,Xiantao Shang,Bowen Man,Cong Zhang,Dandan Li,Shuhui Li,Wenjing Chen,Hongxi Liu,Gefei Wang,Kaihua Cao,Zhaohao Wang,Weisheng Zhao..Integration of high-performance spin-orbit torque MRAM devices by 200-mm-wafer manufacturing platform[J].半导体学报:英文版,2022,43(10):P.64-72,9.基金项目
supported by the National Key Research and Development Program of China(Grant Nos.2021YFB3601303,2021YFB3601304,2021YFB3601300) (Grant Nos.2021YFB3601303,2021YFB3601304,2021YFB3601300)
National Natural Science Foundation of China(Nos.62001014 and 62171013)。 (Nos.62001014 and 62171013)