Vertically Integrated Electronics:New Opportunities from Emerging Materials and DevicesOA
Vertically Integrated Electronics:New Opportunities from Emerging Materials and Devices
Seongjae Kim;Juhyung Seo;Junhwan Choi;Hocheon Yoo
Department of Electronic Engineering,Gachon University,1342 Seongnam-daero,Sujeong-gu,Seongnam,Gyeonggi-do 13120,Republic of KoreaDepartment of Electronic Engineering,Gachon University,1342 Seongnam-daero,Sujeong-gu,Seongnam,Gyeonggi-do 13120,Republic of KoreaCenter of Bio-Integrated Electronics,Northwestern University,Evanston,IL 60208,USAQuerrey Simpson Institute for Bioelectronics,Northwestern University,Evanston,IL 60208,USA
Vertical stackingThree-dimensional integrationMetal routingVia-holeTwo-dimensional semiconductors
Vertical stackingThree-dimensional integrationMetal routingVia-holeTwo-dimensional semiconductors
《纳微快报（英文）》 2022 (12)
195-223,29
This work was supported by the National Research Foundation of Korea(NRF)grants by the Korean Government(MSIT)(NRF-2021R1A6A3A14038580,NRF-2020R1A2C1101647).This work was supported by the Technol-ogy Innovation Program(00144300,Interface Technology of 3D Stacked Heterogeneous System for SCM-based Process-in-Mem-ory)funded by the Ministry of Trade,Industry&Energy(MOTIE,Korea).Open access funding provided by Shanghai Jiao Tong University.
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