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Vertically Integrated Electronics:New Opportunities from Emerging Materials and Devices

Seongjae Kim Juhyung Seo Junhwan Choi Hocheon Yoo

纳微快报（英文）2022，Vol.14Issue(12)：195-223,29.

Vertically Integrated Electronics:New Opportunities from Emerging Materials and Devices

Seongjae Kim ¹Juhyung Seo ¹Junhwan Choi ²Hocheon Yoo³

作者信息

1. Department of Electronic Engineering,Gachon University,1342 Seongnam-daero,Sujeong-gu,Seongnam,Gyeonggi-do 13120,Republic of Korea
2. Center of Bio-Integrated Electronics,Northwestern University,Evanston,IL 60208,USA
3. Querrey Simpson Institute for Bioelectronics,Northwestern University,Evanston,IL 60208,USA
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摘要

关键词

Vertical stacking/Three-dimensional integration/Metal routing/Via-hole/Two-dimensional semiconductors

Key words

Vertical stacking/Three-dimensional integration/Metal routing/Via-hole/Two-dimensional semiconductors

引用本文复制引用

Seongjae Kim,Juhyung Seo,Junhwan Choi,Hocheon Yoo..Vertically Integrated Electronics:New Opportunities from Emerging Materials and Devices[J].纳微快报（英文）,2022,14(12):195-223,29.

基金项目

This work was supported by the National Research Foundation of Korea(NRF)grants by the Korean Government(MSIT)(NRF-2021R1A6A3A14038580,NRF-2020R1A2C1101647).This work was supported by the Technol-ogy Innovation Program(00144300,Interface Technology of 3D Stacked Heterogeneous System for SCM-based Process-in-Mem-ory)funded by the Ministry of Trade,Industry&Energy(MOTIE,Korea).Open access funding provided by Shanghai Jiao Tong University. （NRF）

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ISSN：2311-6706

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