| 注册
首页|期刊导航|热科学学报(英文版)|Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

LIU Dong LI Yunheng HU Anjie

热科学学报(英文版)2022,Vol.31Issue(6):1903-1913,11.
热科学学报(英文版)2022,Vol.31Issue(6):1903-1913,11.

Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

LIU Dong 1LI Yunheng 1HU Anjie1

作者信息

  • 1. School of Civil Engineering and Architecture,Southwest University of Science and Technology,Mianyang 621010,China
  • 折叠

摘要

关键词

boiling heat transfer/boiling curve/bubble dynamic

Key words

boiling heat transfer/boiling curve/bubble dynamic

引用本文复制引用

LIU Dong,LI Yunheng,HU Anjie..Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability[J].热科学学报(英文版),2022,31(6):1903-1913,11.

基金项目

This work is sponsored by the National Natural Science Foundation of China(51606159)and Open Fund of Key Laboratory of Icing and Anti/De-icing(Grant No.IADL20190311). (51606159)

热科学学报(英文版)

OACSCDEISCI

1003-2169

访问量0
|
下载量0
段落导航相关论文