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Modeling and Simulation for Transient Thermal Analyses Using a Voltage-in-Current Latency Insertion Method

Wei Chun Chin Boon Chun New Nur Syazreen Ahmad Patrick Goh

电子科技学刊2022，Vol.20Issue(4)：383-395,13.

电子科技学刊2022，Vol.20Issue(4)：383-395,13.DOI:10.1016/j.jnlest.2022.100180

Modeling and Simulation for Transient Thermal Analyses Using a Voltage-in-Current Latency Insertion Method

Wei Chun Chin ¹Boon Chun New ¹Nur Syazreen Ahmad ¹Patrick Goh¹

作者信息

1. School of Electrical and Electronic Engineering,Universiti Sains Malaysia,Penang 14300
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摘要

关键词

Latency insertion method (LIM)/numerical simulation/thermal analysis/transient simulation

Key words

Latency insertion method (LIM)/numerical simulation/thermal analysis/transient simulation

引用本文复制引用

Wei Chun Chin,Boon Chun New,Nur Syazreen Ahmad,Patrick Goh..Modeling and Simulation for Transient Thermal Analyses Using a Voltage-in-Current Latency Insertion Method[J].电子科技学刊,2022,20(4):383-395,13.

基金项目

This work was supported by the Fundamental Research Grant Scheme(FRGS)sponsored by the Ministry of Higher Education,Malaysia under Grant No.FRGS/1/2020/TK0/USM/02/7. （FRGS）

电子科技学刊

OACSCD

ISSN：1674-862X

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