Review:Phonon Engineering in Thermoelectric Materials

Asfandiyar Sichen Duan Jun Mao Qian Zhang

哈尔滨工业大学学报：英文版2022，Vol.29Issue(6)：P.111-127,17.

哈尔滨工业大学学报：英文版2022，Vol.29Issue(6)：P.111-127,17.DOI:10.11916/j.issn.1005-9113.2022058

Asfandiyar ¹Sichen Duan ¹Jun Mao ²Qian Zhang²

作者信息

1. Institute of Materials Genome&Big Data,School of Materials Science and Engineering,Harbin Institute of Technology,Shenzhen 518055,China
2. Institute of Materials Genome&Big Data,School of Materials Science and Engineering,Harbin Institute of Technology,Shenzhen 518055,China State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China
折叠

phonon transport/engineering defects/nanostructuring/thermal conductivity/zT/thermoelectrics

数理科学

Asfandiyar,Sichen Duan,Jun Mao,Qian Zhang..Review:Phonon Engineering in Thermoelectric Materials[J].哈尔滨工业大学学报：英文版,2022,29(6):P.111-127,17.

Sponsored by the Shenzhen Science and Technology Program (Grant No.KQTD20200820113045081) （Grant No.KQTD20200820113045081）

the National Natural Science Foundation of China (Grant Nos.52172194, 51971081) （Grant Nos.52172194, 51971081）

the National Natural Science Foundation of China (Grant No.52101248) （Grant No.52101248）

the Natural Science Foundation for Distinguished Young Scholars of Guangdong Province of China (Grant No.2020B1515020023) （Grant No.2020B1515020023）

the Shenzhen Fundamental Research Projects (Grant No.JCYJ20210324132808020)。（Grant No.JCYJ20210324132808020）

ISSN：1005-9113

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