首页|期刊导航|半导体学报（英文版）|Emerging trends of integrated-mixed-signal chips in ISSCC 2023

Emerging trends of integrated-mixed-signal chips in ISSCC 2023

Jinbo Chen Jie Yang Mohamad Sawan

半导体学报（英文版）2023，Vol.44Issue(5)：16-20,5.

半导体学报（英文版）2023，Vol.44Issue(5)：16-20,5.DOI:10.1088/1674-4926/44/5/050204

Jinbo Chen ¹Jie Yang ¹Mohamad Sawan¹

作者信息

1. CenBRAIN Neurotech,School of Engineering,Westlake University,Hangzhou 310024,China
折叠

Jinbo Chen,Jie Yang,Mohamad Sawan..Emerging trends of integrated-mixed-signal chips in ISSCC 2023[J].半导体学报（英文版）,2023,44(5):16-20,5.

This work was supported by STI2030-Major Projects 2022ZD0208805. （）

OACSCDCSTPCDEI

ISSN：1674-4926

访问量0

下载量0

段落导航