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Numerical Simulation and Experimental Verification of Temperature Distribution of Piezoelectric Stack with Heating and Thermal Insulation Device

CHEN Yixiao YANG Xinghua YU Li SHEN Xing

南京航空航天大学学报:英文版2021,Vol.38Issue(S01):P.17-23,7.
南京航空航天大学学报:英文版2021,Vol.38Issue(S01):P.17-23,7.DOI:10.16356/j.1005-1120.2021.S.003

Numerical Simulation and Experimental Verification of Temperature Distribution of Piezoelectric Stack with Heating and Thermal Insulation Device

CHEN Yixiao 1YANG Xinghua 2YU Li 2SHEN Xing3

作者信息

  • 1. State Key Laboratory of Mechanics and Control of Mechanical Structures,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,P.R.China Aircraft Strength Research Institute of China,Xi’an 710065,P.R.China
  • 2. China Aerodynamics Research and Development Center,Mianyang 621000,P.R.China
  • 3. State Key Laboratory of Mechanics and Control of Mechanical Structures,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,P.R.China
  • 折叠

摘要

关键词

thermal differential equation/temperature field/finite difference/piezoelectric stack/heating and thermal insulation device

分类

航空航天

引用本文复制引用

CHEN Yixiao,YANG Xinghua,YU Li,SHEN Xing..Numerical Simulation and Experimental Verification of Temperature Distribution of Piezoelectric Stack with Heating and Thermal Insulation Device[J].南京航空航天大学学报:英文版,2021,38(S01):P.17-23,7.

南京航空航天大学学报:英文版

OACSCDCSTPCD

1005-1120

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