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快速热处理化学气相沉积法制备用于电子产品热管理的轻质柔性石墨烯

Satendra Kumar Manoj Goswami Netrapal Singh Uday Deshpande Surender Kumar N. Sathish

新型炭材料2023,Vol.38Issue(3):534-542,9.
新型炭材料2023,Vol.38Issue(3):534-542,9.DOI:10.1016/S1872-5805(23)60737-1

快速热处理化学气相沉积法制备用于电子产品热管理的轻质柔性石墨烯

Flexible and lightweight graphene grown by rapid thermal processing chemical vapor deposition for thermal management in consumer electronics

Satendra Kumar 1Manoj Goswami 1Netrapal Singh 1Uday Deshpande 2Surender Kumar 1N. Sathish1

作者信息

  • 1. Academy of Scientific and Innovative Research (AcSIR),Ghaziabad 201002,India||CSIR - Advanced Materials and Processes Research Institute (AMPRI),Bhopal 462026,India
  • 2. UGC-DAE Consortium for Scientific Research,University Campus,Indore 452001,India
  • 折叠

摘要

Abstract

Next-generation consumer electronics require excellent thermal management.Graphene is a good choice because its thermal conductivity is 13 times that of copper.Single-,bi-and few-layer graphene(SLG,BLG,FLG)with large sp2 domains were grown by rapid thermal processing chemical vapor deposition(RTP-CVD)from CH4 and H2 using Ar as the diluting gas.The quality of graphene was investigated by Raman spectroscopy and TEM.To demonstrate the heat dissipation capability of RTP-CVD-grown graphene,a 2 TB solid state drive was used and the temperature was measured by a FLIR thermal camera.Results indicate that high thermal conductivity graphene was prepared by diluting the precursor gas with Ar.SLG was prepared at a growth temperature of 1 000 ℃ and a time of 25 min.A transition from FLG to high-quality BLG was observed at low H2 concentrations.Using SLG,there was a 5 ℃ lower temperature rise than using a commercial copper heat dissipator.The heat dissipation ability of SLG was approxim-ately 200 times that of commercial copper heat dissipators.

关键词

石墨烯/热管理/消费类电子产品/化学气相沉积

Key words

Graphene/Thermal management/Consumer electronics/Chemical vapour deposition

分类

化学化工

引用本文复制引用

Satendra Kumar,Manoj Goswami,Netrapal Singh,Uday Deshpande,Surender Kumar,N. Sathish..快速热处理化学气相沉积法制备用于电子产品热管理的轻质柔性石墨烯[J].新型炭材料,2023,38(3):534-542,9.

基金项目

Author thanks Director CSIR-AMPRI,Bhopal for providing the characterization facilities.The au-thors would also like to acknowledge the CSIR-NET fellowship(31/041(0078)/2019-EMR-I)and the Ra-man spectrometer(IndiRam CTR-300,Technos In-struments)supported by the NMITLI project.The TEM work was performed at the Analytical HRTEM laboratory,CSIR-AMPRI,Bhopal supported by CSIR under the Facility Creation Project(MLP0110).The XPS analysis was carried out using a SPECS-GmBH surface analyzer,UGC-DAE Consortium for Scientif-ic Research,Indore. (31/041(0078)

新型炭材料

OA北大核心CSCDCSTPCD

1007-8827

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