标准科学Issue(z1)：215-220,6.
中、高温多层陶瓷基板共烧用导体浆料的研究现状及发展趋势
Research State and Development Trend of Conductor Paste for Co-firing of Medium and High Temperature Multilayer Ceramic Substrates
摘要
关键词
中、高温多层共烧陶瓷基板/导体浆料/导电相/填充相/粘结相Key words
medium and high temperature multilayer co-fired ceramic substrates/conductor pastes/conductive phase/filling phase/bonding phase引用本文复制引用
吴亚光,赵昱,刘林杰,张炳渠..中、高温多层陶瓷基板共烧用导体浆料的研究现状及发展趋势[J].标准科学,2023,(z1):215-220,6.
