高压电器2023，Vol.59Issue(8)：223-231,9.DOI:10.13296/j.1001-1609.hva.2023.08.026
基于电—热—力耦合的螺旋弹簧触指稳态温升分布仿真研究
Simulation Study on Steady-state Temperature Rise Distribution of Helical Spring Contact Finger Based on Electrical-thermal-mechanical Coupling
摘要
关键词
弹簧触指/温升分布/多物理场耦合/接触电阻/热故障Key words
spring contact finger/distribution of temperature rise/multi-physics coupling/contact resistance/ther-mal failure引用本文复制引用
马金财,刘刚,何龙..基于电—热—力耦合的螺旋弹簧触指稳态温升分布仿真研究[J].高压电器,2023,59(8):223-231,9.基金项目
国网新疆电力有限公司科技项目(5230CJ220002).Project Supported by Science and Technology of the State Grid Xinjiang Electric Power Co.,Ltd.(5230CJ220002). （5230CJ220002）
