电化学2023，Vol.29Issue(8)：1-12,12.DOI:10.13208/j.electrochem.2208111
铜互连电镀中有机添加剂的合成与分析
Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects
摘要
Abstract
Copper interconnects are essential to the functionality,performance,power efficiency,reliability,and fabrication yield of electronic devices.They are widely found in chips,packaging substrates and printed circuit boards,and are often produced by copper electroplating in an acidic aqueous solution.Organic additives play a decisive role in regulating copper deposition to fill micro-trenches,and micro-vias to form fine lines and interlayer interconnects.Generally,an additive package consists of three components(brightener,suppressor,and leveler),which have a synergistic effect of super-filling on electroplating copper when the concentration ratio is appropriate.Many works of literature have discussed the mechanism of super filling and the electrochemical behavior of representative additive molecules;however,few articles discussed the chemical structure and preparation of the additives.Herein,this paper focuses on the preparation method and the rapid electrochemical screening of each additive component to provide an idea for the future development of copper electroplating additives.关键词
酸性电镀铜/铜互连/抑制剂/光亮剂/整平剂Key words
Acid copper electroplating/Copper interconnect/Suppressor/Brightener/Leveler引用本文复制引用
翟悦晖,彭逸霄,洪延,陈苑明,周国云,何为,王朋举,陈先明,王翀..铜互连电镀中有机添加剂的合成与分析[J].电化学,2023,29(8):1-12,12.基金项目
The authors gratefully acknowledge the support of the National Natural Science Foundation of China(Nos 22172020,61974020 and 22241201).This work is also supported by the Innovation Team Project of Zhuhai City(No.ZH0405190005PWC),the projects of Sci and Tech planning of Guang-dong Province(No.2019B090910003)and Zhuhai City(Nos ZH01084702180040HJL and ZH220170000032PWC). （Nos 22172020,61974020 and 22241201）
