电器与能效管理技术Issue(11)：17-22,6.DOI:10.16628/j.cnki.2095-8188.2023.11.003
基于流-固耦合的车载继电器温度场仿真研究
Temperature Field Simulation of Automobile Relay Based on Fluid-Solid Coupling Method
王其亚1
作者信息
- 1. 厦门宏发汽车电子有限公司,福建厦门 361021
- 折叠
摘要
Abstract
The temperature rise to a certain extent restricts the miniaturization and lightweight development of automobile relays.It is particularly important to analyze the temperature field of automobile relays to improve their heat resistance.The computational fluid dynamics(CFD)simulation tool based on heat conduction differential equations,fluid motion control equations,and radiation heat transfer equations is used to propose a temperature field simulation method for automobile relays based on fluid structure coupling.Using the proposed method the temperature field distribution of a certain automobile relay under different environmental temperatures and load current levels are obtained.The proportion of heat dissipation through conduction,convection,and radiation is calculated.the heat dissipation law of the relay and coil under different environmental temperatures and load current levels is analyzed,which can lay a foundation for the subsequent thermal design and temperature rise optimization of automobile relays.关键词
车载继电器/计算流体力学/流-固耦合/温度场/散热分析Key words
automobile relay/computational fluid dynamics(CFD)/fluid-solid coupling/temperature field/heat dissipation analysis引用本文复制引用
王其亚..基于流-固耦合的车载继电器温度场仿真研究[J].电器与能效管理技术,2023,(11):17-22,6.
