宇航材料工艺2023，Vol.53Issue(6)：87-92,6.DOI:10.12044/j.issn.1007-2330.2023.06.014
真空汽相焊冷却速率对多层板焊点质量的影响
Effect of Cooling Rate of Vacuum Vapor Phase Welding on Solder Joint Quality of Multilayer Printed Circuit Board
吴彬勇 1李婧 1邱静萍 1李少聪 1张绍东1
作者信息
- 1. 上海航天电子有限公司,上海 201821
- 折叠
摘要
Abstract
In order to address the issue of solder joint lines resulted from inadequate post-welding cooling in vacuum vapor phase welding of multi-layer printed boards,this study identified the underlying cause of solder joint lines in multi-layer boards and enhanced the post-welding cooling zone,enabling disclosure of the effects of different welding processes on surface morphology,internal structure morphology,and mechanical properties of solder joints.Experimental findings demonstrated that fast cooling led to thinner interfacial metal compound(IMC)within solder joints and a more uniform distribution of Pb in Sn.The grain diameter of IMC layer formed under fast cooling was approximately 1 μm,while shear strength reached 17.26 MPa-an increase by 43％compared to slow cooling rate-thus achieving fine crystal strengthening objectives.Furthermore,significant improvements have been observed in surface quality by fast cooling reducing solder joint lines.关键词
冷却速率/多层板/焊点纹路/真空汽相焊Key words
Cooling rate/Multilayer PCB/Solder joint grain/Vcuum vapor phase welding分类
信息技术与安全科学引用本文复制引用
吴彬勇,李婧,邱静萍,李少聪,张绍东..真空汽相焊冷却速率对多层板焊点质量的影响[J].宇航材料工艺,2023,53(6):87-92,6.
