湖南大学学报（自然科学版）2023，Vol.50Issue(12)：122-129,8.DOI:10.16339/j.cnki.hdxbzkb.2023313
Al与FeNiCoCrMn系高熵合金扩散焊界面研究
Study on Diffusion Bonding Interface of Al to a Series of FeNiCoCrMn High-entropy Alloy
摘要
Abstract
Al was used for diffusion bonding with FeNiCoCrMn high-entropy alloy(HEA)and its six subsets(Ni、NiCo、FeNi、FeNiCo、NiCoCrA FeNiCoCr)by Spark Plasma Sintering(SPS).The influences of chemical composition on the microstructure,element distribution and phase composition of the interfaces after bonding were investigated in detail,as well as the final microhardness.The results reveal that FeNiCoCrMn HEA had a better diffusion barrier effect on Al than its subsets,and the minimum thickness of the IMC diffusion layer after bonding with Al is only 14.5 μm.The intermetallic compounds(IMCs)generated at the interfaces of Ni,NiCo and FeNi after bonding were mainly Al3Ni-type IMC,while the interfaces of FeNiCo,NiCoCr,FeNiCoCr and FeNiCoCrMn after bonding were mainly Al13Fe4-type IMC,and the greater the proportion of Al13Fe4-type IMC in their respective IMC diffusion layers,the more significant the softening effect of the interface.The interface softening effect of the FeNiCo alloy and Al after bonding was the most obvious,and the lowest interface hardness value was only of 424 HV.关键词
高熵合金/铝/界面/扩散焊Key words
high-entropy alloy/aluminum/interfaces/diffusion bonding分类
金属材料引用本文复制引用
马毅,周力,李忠涛,彭飞,张卫东..Al与FeNiCoCrMn系高熵合金扩散焊界面研究[J].湖南大学学报（自然科学版）,2023,50(12):122-129,8.基金项目
国家重点研发计划资助项目(2022YFB3705500),National Key Research and Development Program of China(2022YFB3705500) （2022YFB3705500）
