成都大学学报（自然科学版）2023，Vol.42Issue(4)：392-400,9.DOI:10.3969/j.issn.1004-5422.2023.04.010
陶瓷基板金属化制备技术的研究进展
Research Progress in Metallization of Ceramic Substrate
张明昌 1辛成来 2李东亚1
作者信息
- 1. 成都大学机械工程学院,四川成都 610106
- 2. 成都大学建筑与土木工程学院,四川成都 610106
- 折叠
摘要
Abstract
This paper summarizes the processes and techniques to enhance the reliability of ceramic sub-strates from the perspective of their manufacturing,including direct copper plating metallization(DPC),thick film metallization(TFC),direct bonding copper metallization(DBC),direct bonding aluminum metallization(DBA)and active metal brazing metallization(AMB).Additionally,the paper outlines the innovative production processes and bonding strength based on the above mentioned metallization meth-ods,as well as elaborates on the drawbacks and shortcomings of ceramic substrates prepared through dif-ferent processes in practical applications.Finally,it predicts the development trend of ceramic substrate metallization.关键词
陶瓷基板/金属化/功率模块/结合强度Key words
ceramic substrate/metallization/power module/bonding strength分类
通用工业技术引用本文复制引用
张明昌,辛成来,李东亚..陶瓷基板金属化制备技术的研究进展[J].成都大学学报（自然科学版）,2023,42(4):392-400,9.
