电子学报2023，Vol.51Issue(10)：2783-2790,8.DOI:10.12263/DZXB.20220390
基于随机振动过程应力分析的BGA焊点结构优化
Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration
摘要
Abstract
A board-level BGA(Ball Grid Array)solder joint finite element model is established.The chip height,sol-der joint diameter,solder joint height,and solder joint spacing are selected as design variables,and the critical solder joint stress is used as the response target.We design 25 groups of solder joint models simulating and calculating based on the Ta-guchi orthogonal and the surface response method The structural parameters of the solder joints are optimized through math-ematical statistical and regression analysis.And the optimal solder structural combination with the minimum joint stress is obtained.The results show that the result of surface response optimization is better than the Taguchi orthogonal under the same conditions.And the best combination of solder joints is solder joint diameter 0.32 mm,solder joint height 0.20 mm,solder joint spacing 0.36 mm.The equivalent stress value of the best combination is 0.391 5 MPa,which is reduced by 0.65 MPa.They show that the optimization of the structural parameters of BGA solder joints is achieved.关键词
BGA焊点/田口正交/曲面响应/有限元Key words
BGA solder joint/taguchi orthogonal/surface response/finite element分类
信息技术与安全科学引用本文复制引用
杨雪霞,孙勤润,王超,彭银飞,张伟伟..基于随机振动过程应力分析的BGA焊点结构优化[J].电子学报,2023,51(10):2783-2790,8.基金项目
国家自然科学基金(No.11602157) （No.11602157）
山西省自然科学基金面上项目(No.20210302123220) （No.20210302123220）
广东省普通高校机器人与智能装备重点实验室资助项目(No.2017KSYS009) （No.2017KSYS009）
东莞理工学院机器人与智能装备创新中心资助项目(No.KCYCXPT2017006)National Natural Science Foundation of China(No.11602157) （No.KCYCXPT2017006）
Shanxi Provincial Natural Sci-ence Foundation(No.20210302123220) （No.20210302123220）
Supported Project by the Key Laboratory of Robotics and Intelligent Equipment in Guangdong Province's Ordinary Universities(No.2017KSYS009) （No.2017KSYS009）
Supported by the Robot and Intelligent Equipment Inno-vation Center of Dongguan Institute of Technology(No.KCYCXPT2017006) （No.KCYCXPT2017006）
