空间电子技术2023，Vol.20Issue(6)：14-21,8.DOI:10.3969/j.issn.1674-7135.2023.06.003
非接触式低无源互调温箱穿仓接口技术
Contactless low passive intermodulation through-wall technology of temperature chamber
摘要
Abstract
Temperature cycle PIM test is necessary to evaluate the PIM performance of space microwave products.Unfortunately,the traditional temperature chamber's through-wall waveguide connection always cause residual PIM deterioration because of stress,temperature change and other factors,which seriously affects the sensitivity and efficiency of temperature cycle PIM test.To solve this problem,a contactless low PIM through-wall technology is proposed,contactless port is designed for the through-wall structure based on the principle of contactless EM shielding,which avoids the electrical contact factors that cause PIM,by which a kind of low PIM electrical connection of the temperature chamber's through-wall is achieved.The PIM suppression of the contactless structure is analyzed,and a Ku-band prototype is designed and test.The measured 3rd residual PIM level is less than-140 dBm@2×100 W under several temperature cycles,obtaining a stable low residual PIM level,which greatly improves the PIM test performance and efficiency,and can be widely used in various kinds of PIM test applications.关键词
无源互调/非接触/PIM检测/温循Key words
passive intermodulation/contactless/PIM test/temperature cycle分类
电子信息工程引用本文复制引用
陈翔,胡少光,双龙龙,胡天存,崔万照..非接触式低无源互调温箱穿仓接口技术[J].空间电子技术,2023,20(6):14-21,8.基金项目
国家自然科学基金青年基金项目(编号:61901359) （编号:61901359）
国家重点实验室基金项目(编号:6142411232204) （编号:6142411232204）
