Ge对Sn-58Bi焊料合金微观组织和性能的影响OACSTPCD
Effect of Ge on microstructure and properties of Sn-58Bi solder alloy
Sn-Bi焊料是一种低温无铅焊料,在低温焊接领域应用较为广泛,但其存在脆性大和延展性差的缺点.为此,制备不同Ge含量的Sn-58Bi焊料合金,研究不同Ge添加量对Sn-58Bi焊料合金的显微组织、熔化特性、润湿性和力学性能的影响.结果表明:添加Ge元素可以显著细化Sn-58Bi焊料合金的共晶组织.当添加的Ge元素质量分数为0.005%～0.01%时,焊料合金的湿润性有明显提升;Ge的添加量从0增大到0.01%时,Sn-58Bi合金的拉伸强度和断后伸长率均提升显著,但继续增加Ge的含量,合金拉伸强度和断后伸长率提升缓慢.Ge元素的添加对Sn-58Bi焊料合金的熔点基本没有影响.
Sn-Bi solder is a low-temperature lead-free solder that is widely used in low-temperature soldering,but it has the disadvantages of high brittleness and poor ductility.On this basis,Sn-58Bi solder alloys with different Ge contents are prepared,and the effects of different Ge additions on the microstructure,melting properties,wettability and mechanical properties of Sn-58Bi solder alloys are researched.The results show that adding Ge element can significantly refine the eutectic structure of Sn-58Bi solder alloy.When adding 0.005%～0.01%of Ge element,the wettability of the solder alloy is significantly improved.When the addition amount of Ge is increased from 0 to 0.01%,the tensile strength and elongation after fracture of Sn-58Bi alloy are significantly improved.If the content of Ge continues to increase,the tensile strength and elongation after fracture of the alloy is increased slowly.The addition of Ge element has little effect on the melting point of Sn-58Bi solder alloy.
王同举;刘亚浩;冷启顺;张文倩
北华航天工业学院 电子与控制工程学院, 河北 廊坊 065000
电子信息工程
Sn-58Bi焊料合金Ge元素微观组织润湿性力学性能DSC曲线
Sn-58Bi solder alloyGe elementmicrostructurewettabilitymechanical propertiesDSC curve
《现代电子技术》 2024 (002)
21-25 / 5
河北省重大科技专项(21280201Z);河北省自然科学基金项目(F2021409006)
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