现代电子技术2024，Vol.47Issue(2)：21-25,5.DOI:10.16652/j.issn.1004-373x.2024.02.005
Ge对Sn-58Bi焊料合金微观组织和性能的影响
Effect of Ge on microstructure and properties of Sn-58Bi solder alloy
摘要
Abstract
Sn-Bi solder is a low-temperature lead-free solder that is widely used in low-temperature soldering,but it has the disadvantages of high brittleness and poor ductility.On this basis,Sn-58Bi solder alloys with different Ge contents are prepared,and the effects of different Ge additions on the microstructure,melting properties,wettability and mechanical properties of Sn-58Bi solder alloys are researched.The results show that adding Ge element can significantly refine the eutectic structure of Sn-58Bi solder alloy.When adding 0.005%～0.01%of Ge element,the wettability of the solder alloy is significantly improved.When the addition amount of Ge is increased from 0 to 0.01%,the tensile strength and elongation after fracture of Sn-58Bi alloy are significantly improved.If the content of Ge continues to increase,the tensile strength and elongation after fracture of the alloy is increased slowly.The addition of Ge element has little effect on the melting point of Sn-58Bi solder alloy.关键词
Sn-58Bi焊料合金/Ge元素/微观组织/润湿性/力学性能/DSC曲线Key words
Sn-58Bi solder alloy/Ge element/microstructure/wettability/mechanical properties/DSC curve分类
电子信息工程引用本文复制引用
王同举,刘亚浩,冷启顺,张文倩..Ge对Sn-58Bi焊料合金微观组织和性能的影响[J].现代电子技术,2024,47(2):21-25,5.基金项目
河北省重大科技专项(21280201Z) （21280201Z）
河北省自然科学基金项目(F2021409006) （F2021409006）
