西安科技大学学报2023，Vol.43Issue(6)：1099-1109,11.DOI:10.13800/j.cnki.xakjdxxb.2023.0608
基于微电子封装焊点超声图像边缘效应分析的可靠性无损评价方法
A non-destructive evaluation approach to solder joint reliability in microelectronic packaging based on the analysis of edge effects in ultrasonic images
摘要
Abstract
The integration and miniaturization of electronic packaging technology have set higher stand-ards for the non-destructive evaluation methods of internal solder joints within the packaging.To ad-dress the reliability of solder joints in microelectronic packaging,a reliability non-destructive evaluation method based on ultrasonic image edge effect analysis of microelectronic packaging solder joints was proposed.Initially,the test boards loaded with flip-chip packaging was designed and aged using accel-erated thermal cycling test.Solder joint degradation was regularly monitored by taking out the test boards from the temperature chamber for ultrasound data acquisition at every four test cycles.Subse-quently,an in-depth study of the propagation mechanism of ultrasonic waves within electronic packa-ging was conducted using finite element simulation,establishing a qualitative and quantitative relation-ship between the geometric features of solder joint ultrasonic images and the actual physical character-istics of the solder joints.On the basis of this theory,an edge extraction algorithm for solder joint ultra-sonic image was proposed,optimizing the positioning of the central area in the solder joint ultrasonic images.Ultimately,the failure period of solder joints at different positions was determined by the bright-ness change of the central area of the solder joint image.Using the root mean square error as an evalua-tion indicator,the results of this study were compared with those from previous research.The results demonstrate that the proposed edge detection algorithm exhibits significant advantages in handling low-quality solder joint images,has good anti-noise performance,and can obtain clear single-pixel edges.In terms of solder joint reliability assessment,compared to previous methods,the root mean square error was enhanced from 137.11 to 41.23,and the accuracy of detection was improved by 69.96％,signifi-cantly increasing the accuracy of solder joint reliability assessment.This provides a solid theoretical ba-sis for non-destructive evaluation of solder joints in microelectronic packaging.关键词
微电子封装/无损评价/可靠性/边缘效应/焊点/热循环加速试验Key words
microelectronic package/non-destructive evaluation/reliability/edge effect/solder joint/accelerated thermal cycling test分类
信息技术与安全科学引用本文复制引用
马宏伟,王浩添,张广明,陈渊,董明..基于微电子封装焊点超声图像边缘效应分析的可靠性无损评价方法[J].西安科技大学学报,2023,43(6):1099-1109,11.基金项目
国家自然科学基金项目(61674121,51705418) （61674121,51705418）
