红外与毫米波学报2023，Vol.42Issue(6)：748-755,8.DOI:10.11972/j.issn.1001-9014.2023.06.007
基于键合金丝补偿的太赫兹瓦级功率合成技术研究
Research on watt-level power combining technology at terahertz band based on bonding wire compensation
摘要
Abstract
With the application demands of solid-state high power in the terahertz(THz)band,a THz-band watt-level power output is achieved by adopting GaN power amplifier(PA)MMIC and power combining technology.Microstrip-waveguide transition,and the low-loss interconnection based on the gold wire compensation are used to package a PA module composed of two PA MMICs and an E-plane T-junction two-way power splitter/combiner.Maximum output power of 160 mW is achieved.Based on the module and an eight-way E-plane combiner,a sixteen-way power combin-ing amplifier is designed across the frequency range of 180 to 238 GHz.Output power of more than 300 mW is achieved with +10 V drain voltage,and the maximum power is 1.03 W at 189 GHz.关键词
太赫兹/金丝补偿/氮化镓/功率分配/合成器Key words
THz/gold wire compensation/GaN/power splitter/combiner分类
信息技术与安全科学引用本文复制引用
朱翔,张俊杰,成海峰,郭健,施永荣,王维波..基于键合金丝补偿的太赫兹瓦级功率合成技术研究[J].红外与毫米波学报,2023,42(6):748-755,8.基金项目
中央高校基本科研业务费专项资金资助(NF2020003),重点实验室基金(612502200302) Supported by the Fundamental Research Funds for the Central Universities(NF2020003),key Laboratory Fund(612502200302) （NF2020003）
