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A Detailed Thermal Resistance Network Analysis of FCBGA Package

DANG Hao LU Yang DU Yanzheng ZHANG Xiu ZHANG Qian MA Weigang ZHANG Xing

热科学学报（英文版）2024，Vol.33Issue(1)：18-28,11.

热科学学报（英文版）2024，Vol.33Issue(1)：18-28,11.DOI:10.1007/s11630-023-1903-y

A Detailed Thermal Resistance Network Analysis of FCBGA Package

DANG Hao ¹LU Yang ¹DU Yanzheng ¹ZHANG Xiu ²ZHANG Qian ²MA Weigang ¹ZHANG Xing¹

作者信息

1. Key Laboratory for Thermal Science and Power Engineering of Ministry of Education,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China
2. Zhongxing Telecom Equipment Corporation,Shanghai 201203,China
折叠

摘要

关键词

FCBGA package/thermal resistance network/thermal spreading resistance/junction temperature

Key words

FCBGA package/thermal resistance network/thermal spreading resistance/junction temperature

引用本文复制引用

DANG Hao,LU Yang,DU Yanzheng,ZHANG Xiu,ZHANG Qian,MA Weigang,ZHANG Xing..A Detailed Thermal Resistance Network Analysis of FCBGA Package[J].热科学学报（英文版）,2024,33(1):18-28,11.

基金项目

This work was supported by the National Natural Science Foundation of China(NSFC)(Grants.52176078,and 51827807),the Research Foundation of Zhongxing Telecom Equipment Corporation(Analysis and optimization of internal thermal resistance of FCBGA chip)and the Tsinghua University Initiative Scientific Research Program. （NSFC）

热科学学报（英文版）

OAEI

ISSN：1003-2169

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