1,3-二(2'-氨基亚乙基)-2-甲基咪唑溴盐与环氧树脂E-51的固化工艺OACSTPCD
Curing process of 1,3-di(2'-aminoethyl)-2-methylimidazolium bromide with epoxy resin E-51
通过咪唑环上的季铵化反应,制备一种适用于环氧树脂的双氨基咪唑类离子液体固化剂1,3-二(2'-氨基亚乙基)-2-甲基咪唑溴盐(DAIL).以环氧树脂E-51作为基体树脂,深入研究DAIL作为固化剂的固化工艺条件和固化物的性能.结果表明,DAIL可作为环氧树脂E-51的中温固化剂使用,二者的最佳质量比为DAIL∶E-51=20∶100,最佳固化温度范围为74～105 ℃,后固化温度为162℃固化后的浇注体样条抗拉强度为159 MPa,弹性模量为2 281 MPa,断裂伸长率为12.8％,热分解温度为424.4℃.DMA分析表明DAIL/E-51浇注体最大损耗因子tan δ为0.56,玻璃转化温度θg为83℃,对应的贮存模量E为290 MPa,交联密度为30 149 mol·m-3.该结果为高力学性能中温环氧树脂固化剂的使用提供了重要实验依据.
A diaminoimidazole ionic liquid curing agent,1,3-di(2'-aminoethyl)-2-methylimidazolium bromide(DAIL)is prepared via quaternization of imidazole rings.With epoxy resin E-51 as matrix resin,the curing process conditions of DAIL as curing agent and the properties of cured products are studied in depth.The results show that DAIL can be used as a medium temperature curing agent for epoxy resins.The optimal ratio of the two is DAIL:E-51=20:100,the optimal curing temperature range is 74～105℃,and the post-curing temperature is 162 ℃.The tensile strength of the cured cast body splines is 159 MPa,the elastic modulus is 2 281 MPa,and the elongation at break is 12.8％,the thermal decomposition temperature is 424.4 ℃.DMA analysis shows that the maximum loss factor tan8 of the DAIL/E-51 cast body is 0.56,and the glass transition temperature θg is 83 ℃,the corresponding storage modulus E is 290 MPa,and the crosslinking density is 30 149 mol·m-3.This study provides an important experimental basis for the use of high mechanical properties of medium temperature epoxy resin curing agent.
苏泽;白金虎;吴琼;刘龙;张延强
郑州大学河南先进技术研究院,郑州 450001||郑州中科新兴产业技术研究院,郑州 450000中国科学院过程工程研究所中国科学院粉体材料技术重点实验室,北京 100190郑州中科新兴产业技术研究院,郑州 450000中国科学院过程工程研究所中国科学院粉体材料技术重点实验室,北京 100190||郑州中科新兴产业技术研究院,郑州 450000
1,3-二(2'-氨基亚乙基)-2-甲基咪唑溴盐环氧树脂固化剂固化原理固化动力学
1,3-di(2'-aminoethyl)-2-methylimidazolium bromideepoxy resincuring agentcuring principlecuring kinetics
《中国科学院大学学报》 2024 (001)
42-49 / 8
国家自然科学基金(22178359,21878278)资助
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