集成电路与嵌入式系统2024，Vol.24Issue(2)：1-9,9.
Chiplet技术:拓展芯片设计的新边界
Chiplet:expanding the innovative boundaries of chip design
摘要
Abstract
Chiplet integrates multiple small chips into a system chip,aiming to achieve various goals such as chip reusability,heterogeneous in-tegration,performance enhancement,and cost reduction.The development trends of the Chiplet primarily encompass heterogeneous inte-gration,innovative interconnects,and advanced packaging.Notably,interface interconnection is the key of Chiplet technology.Intercon-nection using the design of physical layer interfaces and data transmission protocols,considering factors like process,packaging tech-niques,power constraints,and requirements of upper-level applications.Serial and parallel interconnects are two choices for chip-to-chip physical layer interfaces,each with its own advantages and application scenarios.Additionally,for different propagation media,emerging interconnect technologies such as optical and wireless interconnects offer higher bandwidth,lower power consumption,and more flexible interconnection topologies.Chiplet is promising to bring significant breakthroughs and advancements to the field of electronics,promoting more efficient,flexible,and innovative chip design and manufacturing.关键词
芯粒/接口互连标准/光互连/并行互连/串行互连Key words
Chiplet/interface interconnection standard/optical interconnection/parallel interconnection/serial interconnection分类
信息技术与安全科学引用本文复制引用
厉佳瑶,张琨,潘权..Chiplet技术:拓展芯片设计的新边界[J].集成电路与嵌入式系统,2024,24(2):1-9,9.基金项目
国家自然科学基金面上项目(62074074). （62074074）
