集成电路与嵌入式系统2024，Vol.24Issue(2)：10-22,13.
Chiplet技术发展与挑战
Development and challenges of Chiplet technology
摘要
Abstract
As the size of semiconductor technology gradually approaches the physical limit,the progress of process technology has led to a decreasing improvement in the power consumption,area,and other performance of chips,semiconductor technology has entered the"post-Moore era".In order to further meet the high bandwidth communication needs brought about by the rapid development of machine learning,artificial intelligence,and other information and communication industries,Chiplet technology which based on advanced inter-connection and packaging techniques,steps into the picture.Chiplet technology disassembles the original complex multifunctional SoC chip into small chips with small area,low cost,and different process nodes,and assembles them through advanced packaging technology,which has received high attention from academia and industry due to its advantages of high yield,low cost,high integration,strong per-formance,good flexibility,and fast time-to-market.This paper summarizes and elaborates on the technical characteristics,advantages,de-velopment history,and specific applications of Chiplet.Meanwhile,the core technologies of Chiplet,especially Chiplet D2D interconnect technology,are introduced in detail.Finally,the existing technical issues and challenges of Chiplet are described,and the suggestions for future development are put forward.关键词
芯粒/裸片互连/高速串行接口/单端并行接口/UCIe/SerDesKey words
Chiplet/D2D/high-speed serial interface/single-ended parallel interface/UCIe/SerDes分类
信息技术与安全科学引用本文复制引用
刘朝阳,任博琳,王则栋,吕方旭,郑旭强..Chiplet技术发展与挑战[J].集成电路与嵌入式系统,2024,24(2):10-22,13.基金项目
"光电子与微电子器件及集成"国家重点研发计划(2021YFB2206602) （2021YFB2206602）
国家自然科学基金(92373119). （92373119）
