集成电路与嵌入式系统2024，Vol.24Issue(2)：31-40,10.
异构集成互连接口研究综述
Research on the heterogeneous integrated interconnect interface
摘要
Abstract
With the development of integrated circuits to the Beyond Moor era,the heterogeneous integration technology has become an e-merging direction of microelectronics.The interconnect interface,the key to the heterogeneous integration technology,is critical to heter-ogeneous integrated chip and system.In order to promote the implementation of heterogeneous integrated interconnect interface,the structure of the heterogeneous integrated chip and system is described and the heterogeneous integration technology is summarized into four technical routes:large chip by integrated chiplets,larger chip by integrated large chips,wafer-level chips and wafer-level systems.The characteristics of the heterogeneous integrated interconnect interface are summarized.The current research status and existing prob-lems in the industry and academia around the heterogeneous integrated interconnect interface are analyzed.Finally,the future develop-ment trend and the needed technical characteristics of the heterogeneous integrated interconnect interface are given by this article.关键词
异构集成/先进封装/Chiplet技术/晶上系统/互连接口Key words
heterogeneous integration/advanced packaging/Chiplet technology/system on wafer/interconnect interface分类
信息技术与安全科学引用本文复制引用
李沛杰,刘勤让,陈艇,沈剑良,吕平,郭威..异构集成互连接口研究综述[J].集成电路与嵌入式系统,2024,24(2):31-40,10.基金项目
科技部重点研发计划项目(2022YFB4401401和2023YFB4404202). （2022YFB4401401和2023YFB4404202）
