集成电路与嵌入式系统2024，Vol.24Issue(2)：41-49,9.
芯粒功能划分方法与互连体系综述
Chipet functional partitioning and interconnection review
摘要
Abstract
Facing the challenge of the"area wall"in chip design,there is a significant increase in chip manufacturing costs.The chiplet technology enables the production of small area chips using a mature process,and composing by advanced packaging techniques,which can overcome the limitations imposed by the area wall,facilitating agile chip design and reducing overall design costs.Determining an op-timal chiplet particle size to meet flexible chip design requirements remains a crucial issue when utilizing chiplet technology.Further-more,achieving interconnectivity between functional chiplets after dividing chip functions is pivotal for realizing the final functionality of the chip.Therefore,this paper provides a comprehensive review of recent research on chiplet function division,spatial exploration in chiplet design and the influence of chiplet function division on the inter-chip interconnect,while also pointing out that chipet design methodology is an important research direction for the development of chiplet technology in the future.关键词
芯粒/芯粒功能颗粒度/芯粒间互连/AMD/SiPKey words
Chiplet/Chiplet particle/interconnectivity of chiplets/AMD/SiP分类
信息技术与安全科学引用本文复制引用
陈龙,黄乐天..芯粒功能划分方法与互连体系综述[J].集成电路与嵌入式系统,2024,24(2):41-49,9.基金项目
高可扩展多芯粒异构集成存内计算加速器架构研究(92373111). （92373111）
