真空电子技术Issue(1)：42-45,4.DOI:10.16540/j.cnki.cn11-2485/tn.2024.01.09
微晶氧化铝在薄壁陶瓷封装外壳上的应用
Application of Microcrystalline Alumina in Thin-Wall Ceramic Shell
王东生 1张义政 1刘阳1
作者信息
- 1. 中国电子科技集团公司第十三研究所 ,河北石家庄 050051
- 折叠
摘要
Abstract
The thin-walling of alumina ceramic packaging shell is beneficial for improving heat dissipa-tion capacity and reducing shell weight,but there are reliability risks in practical applications,especially in harsh working conditions for example the aerospace.It is generally believed that the strength and airtight-ness of alumina are crucial to solve the reliability problem of thin-wall ceramic packaging shells.Micro-crystalline alumina ceramics are independently developed,and the bending strength and airtightness of the ceramics are tested.By using the microcrystalline alumina ceramics,a thin-wall ceramic packaging shell with overall dimension of 1.6 mm×1.2 mm and a wall thickness of 0.15 mm is prepared.It passes the re-liability verification and meets the application requirements of new electronic devices.关键词
微晶/氧化铝/薄壁/陶瓷封装/气密性Key words
Microcrystalline/Alumina/Thin-wall/Ceramic enclosure/Air tightness分类
化学工程引用本文复制引用
王东生,张义政,刘阳..微晶氧化铝在薄壁陶瓷封装外壳上的应用[J].真空电子技术,2024,(1):42-45,4.
