舰船电子工程2023，Vol.43Issue(12)：223-227,5.DOI:10.3969/j.issn.1672-9730.2023.12.045
不同温度应力下陶封器件Au-Al键合可靠性研究
Reliability Research of Au-Al Bonding in Ceramic Packaging Under Different Temperature Stresses
摘要
Abstract
In order to study the influence of different temperature stress on the reliability of Au-Al bonding,the temperature cycles test and high temperature storage test are used to analyze the intermetallic compound(IMC)microstructure of the Au-Al bonding point of the ceramic packaged device.The results show that obvious delamination phenomenon occurs under both tempera-ture stress conditions.Due to solid-solid diffusion reaction,stress is concentrated at the delamination interface,crack is more likely to initiate and expand,which cause the reliability of device reduced.Comparing the crack morphology at the delamination interface under the test conditions of 3000 temperature cycles,150/360h,and 250/360h,the crack length gradually increases,indicating that constant temperature stress is more likely to promote IMC crack growth.When the temperature is higher,the crack growth is faster,which result in greater impact on device reliability.关键词
陶瓷封装/Au-Al键合/温度应力/金属间化合物/可靠性Key words
ceramic packaging/Au-Al bonding/temperature stresses/intermetallic compound/reliability分类
信息技术与安全科学引用本文复制引用
李振远,万永康,虞勇坚,孟智超..不同温度应力下陶封器件Au-Al键合可靠性研究[J].舰船电子工程,2023,43(12):223-227,5.基金项目
科技部国家重点研发计划"高温传感器专用ASIC工艺平台开发"(编号:2021YFB3202703)资助. （编号:2021YFB3202703）
