机电工程技术2024，Vol.53Issue(2)：267-269,298,4.DOI:10.3969/j.issn.1009-9492.2024.02.058
三电平模组散热设计及数值分析
Three-level Module Heat Dissipation Design and Numerical Analysis
苏雷 1恽强龙 1张广泰 1吴继平1
作者信息
- 1. 常州博瑞电力自动化设备有限公司,江苏常州 213025||江苏省柔性输变电装备工程技术研究中心,江苏常州 213025
- 折叠
摘要
Abstract
Taking into account factors such as processing convenience,temperature uniformity and practicality,a spiral shaped heat sink suitable for arranging distributed power devices has been designed.Based on the application scenario of a three-level half bridge module structure,combine with power device losses,conventional engineering application requirements for water cooling systems,as well as the difficulty and economy of structural processing technology,two heat sink channel structures are designed with inlet and outlet water temperature difference and inlet flow rate as variables.Both channels adopt a spiral shaped channel structure with strong temperature uniformity.According to device installation requirements,parallel channels and series parallel channels with S-bends are spliced separately.Through simulation analysis of flow resistance and temperature,the corresponding flow resistance data of the two schemes,as well as the maximum temperature and temperature difference data of the IGBT installation surface,are obtained.Based on the design requirements of the heat dissipation system,the rationality of flow distribution in the flow channel design scheme is comprehensively evaluated and judged.Based on the heat dissipation effect and heat dissipation economy,compare the flow resistance and design margin of the channel,and determine the optimal design scheme of the radiator channel under conventional water cooling conditions.The research achievement provides guidance for the design of helical water-cooled radiators.关键词
散热器/流道设计/流阻/散热效果Key words
heat sink/design of flow channel/flow resistance/heat dissipation effect分类
信息技术与安全科学引用本文复制引用
苏雷,恽强龙,张广泰,吴继平..三电平模组散热设计及数值分析[J].机电工程技术,2024,53(2):267-269,298,4.
