家电科技2024，Vol.1Issue(1)：66-71,6.DOI:10.19784/j.cnki.issn1672-0172.2024.01.010
集成灶蒸烤箱温度场改善的仿真模拟及实验研究
Simulation and experimental study on thermal field improvement of integration cooking appliances
王志江 1邹宇辉 1赵科 1殷彤彤1
作者信息
- 1. 浙江苏泊尔厨卫电器有限公司 浙江绍兴 312073
- 折叠
摘要
Abstract
Due to the structural of the integration cooking appliances,steam oven modular's tank is often flat and long,resulting in poor temperature uniformity,which is more obvious when the baking tray is used as the food carrier.The internal temperature of the steaming oven module is simulated by using the grill and the baking pan as the food carrier,and it is found that the internal temperature field of the steaming oven module is poor when the baking pan is used as the food carrier.Through the optimization of fan speed and baking pan structure,it is found that when the rotation speed of the circulating fan is increased from 800 r/min to 1500 r/min,and 10 through-hole schemes with a total area of 2606.27 mm2 are added to the handles on both sides of the baking pan,the temperature uniformity of the baking pan is increased from 23.3℃to 5.3℃.The results of this study provide theoretical value and data basis for the subsequent technical research and new product development of steamed and baked products.关键词
集成灶/蒸烤模块/温度均匀性Key words
Integration cooking appliances/Steam oven modular/Temperature uniformity分类
化学化工引用本文复制引用
王志江,邹宇辉,赵科,殷彤彤..集成灶蒸烤箱温度场改善的仿真模拟及实验研究[J].家电科技,2024,1(1):66-71,6.
