低压Si MOSFETs对SiC/Si级联器件短路特性的影响OA北大核心CSTPCD
Effect of Low-Voltage Si MOSFETs on Short-Circuit Characteristics of SiC/Si Cascode Devices
由低压硅金属-氧化物-半导体场效应晶体管(Silicon Metal-Oxide-Semiconductor Field-Effect Transistor,Si MOSFET)和碳化硅结型场效应晶体管(Silicon Carbon Junction Field-Effect Transistor,SiC JFET)构成的 SiC/Si级联(Cascode)器件,兼具了低压Si MOSFET易于驱动、SiC JFET高耐压低损耗等优点.该文采用实验和数值模拟的方式研究了低压Si MOSFET对SiC/Si级联器件短路特性的影响,结果表明,在短路过程中SiC/Si级联器件中的SiC JFET最高温度比单独的SiC JFET短路时的最高温度低,SiC/Si级联器件的短路失效时间得到了延长,并且随着Si MOSFET额定电压的增加,SiC/Si级联器件短路失效延长的时间也在增加.
SiC/Si cascode device,formed by low-voltage Silicon Metal-Oxide-Semiconductor Field-Effect Transistor(Si MOSFET)and Silicon Carbon Junction Field-Effect Transistor(SiC JFET),has several advantages such as low driving-voltage of Si MOSFET,high blocking-voltage,and low loss of SiC JFET.In this paper,the effect of low-voltage Si MOSFET on the short-circuit performance of SiC/Si cascode device has been investigated with experiment and numerical simulation.The results give that during the short circuit,the highest temperature of SiC JFET in the cascode case is lower than that of single SiC JFET case,so the short-circuit failure duration of SiC/Si cascode device is longer than that of single SiC JFET.Moreover,with the increasing in the rated voltage of Si MOSFET,the short-circuit failure duration for SiC/Si cascode device also increases.
周郁明;楚金坤;周伽慧
安徽工业大学安徽省高校电力电子与运动控制重点实验室,马鞍山 243002
电子信息工程
泄漏电流SiC/Si级联器件SiC JFET短路失效
leakage currentSiC/Si cascode deviceSiC JFETshort-circuit failure
《电子科技大学学报》 2024 (002)
174-179 / 6
安徽省自然科学基金(2008085ME157);安徽高校自然科学研究项目(KJ2020A0247)
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