空天预警研究学报2023，Vol.37Issue(6)：438-441,4.DOI:10.3969/j.issn.2097-180X.2023.06.010
基于厚薄膜混合封装基板的射频系统级封装设计
Design of RF-SIP based on thick/thin-film-hybrid packaging substrate
张磊 1肖磊2
作者信息
- 1. 海军装备部驻南京地区第三军事代表室,南京 210001
- 2. 南京电子技术研究所,南京 210039||江苏省多维感知信息技术联合实验室,南京 210039
- 折叠
摘要
Abstract
The heat dissipation problem of high-power microwave chip system-in-package(SIP)can be effec-tively solved by adopting the form of chip flip,but LTCC/HTCC packaging substrates based on thick film technol-ogy and flip chips have the problem of size mismatch and inability to directly interconnect.In view of the above problems,a packaging substrate based on thick/thin-film hybrid technology is designed.Firstly,the problem of size mismatch between the chip and the packaging substrate is solved by using the traditional thick film technolo-gy inside and thin film wiring technology on the surface.Then,the size of ground co-planar waveguide(CPWG)matching the chip is designed;a trapezoidal transition structure is used to match it with the vertical through-hole size of the packaging substrate.Finally,the thermal simulation is conducted to verify the heat dissipation perfor-mance of the system.The simulation results show that under the condition of good RF performance,the heat dissi-pation performance of the packaging structure designed in this paper is better than that of the traditional packag-ing.关键词
系统级封装/芯片倒装/厚薄膜混合技术/垂直过渡结构/带地共面波导/散热Key words
system-in-package/chip flip/thick/thin-film hybrid technology/vertical transition structure/ground co-planar waveguide/heat dissipation分类
信息技术与安全科学引用本文复制引用
张磊,肖磊..基于厚薄膜混合封装基板的射频系统级封装设计[J].空天预警研究学报,2023,37(6):438-441,4.
