压接型IGBT器件短路失效管壳爆炸特性及防护方法OA北大核心CSTPCD
Explosion Characteristics and Protection Methods of the Shell in Press Pack IGBT Devices Short-circuit Failure
压接型绝缘栅双极性晶体管(insulated gate bipolar transistor,IGBT)作为现有柔性直流输电设备的核心部件,在实际应用中,由于承受高电压、大电流的工作环境,容易发生短路过流失效,进而造成的结构爆炸现象.为研究这一爆炸现象的破坏效应及其防护,该文结合多组模拟模块化多电平工况实验,得到IGBT器件短路过流失效爆炸后外壳结构的变形特征.结合电气能量特性的分析和实际爆炸失效形貌特点,建立该IGBT器件结构的数值仿真模型,初步确定实际爆炸过程中的等效TNT爆炸当量.在此基础上,从提高结构自身抗爆能力、增加能量外泄通道、替换结构材料等角度开展 IGBT 器件的结构优化设计,并进行相关试验验证.结果表明,将管壳的陶瓷材料替换为纤维增强复合材料可有效提高结构的防爆性能,降低器件的破坏程度.
Nowadays,press pack insulated gate bipolar transistors(IGBTs)are the core parts of the existing flexible HVDC equipment.In practical applications,owing to high-voltage and large-current working environment,press pack IGBT devices are prone to short-circuited passing effects,which is likely to give rise to structural explosion.In order to research the damage effect of this explosion and its protection,this paper carries out multiple groups of modular multilevel converter(MMC)working experiments,and obtains the deformation characteristics of the structure of the IGBT device short-circuit loss after the explosion of the explosion.Combined with the characteristics of the actual explosion failure,the equivalent TNT explosion equivalent in the actual explosion is initially determined.On this basis,the structural optimization design of IGBT devices is carried out from the perspective of improving the structural anti-explosion capacity,increasing energy leakage channels,and replacing structural materials.Based on the analysis of the failure characteristics of the IGBT device structure and electrical energy characteristics,the numerical simulation model of the IGBT device structure is established,the response characteristics of the explosion structure of the device under different TNT volume and explosive position conditions are analyzed,and then relevant test verification is carried out.The result shows that replacing the ceramic material of the shell to fiber enhanced composite materials can effectively improve the explosion-resistant performance of the structure and reduce the destruction of the device.
周扬;唐新灵;王亮;张晓伟;代安琪;林仲康;金锐;魏晓光
先进输电技术国家重点实验室(北京智慧能源研究院),北京市 昌平区 102209爆炸科学与技术国家重点实验室(北京理工大学),北京市 海淀区 100081
动力与电气工程
压接型绝缘栅双极性晶体管器件短路失效爆炸特性防爆仿真
press pack insulated gate bipolar transistor(IGBT)short circuit failureexplosion characteristicsexplosion-proofsimulation
《中国电机工程学报》 2024 (006)
2350-2361,后插23 / 13
国家电网公司科技项目(压接IGBT芯片与封装的绝缘配合与优化技术研究,5500-202158435A-0-0-00).The Science and Technology Project of State Grid Corporation(Research on the Insulation Coordination and Optimization Technology of Press IGBT Chip and Package,5500-202158435A-0-0-00).
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