湖南大学学报（自然科学版）2024，Vol.51Issue(4)：10-19,10.DOI:10.16339/j.cnki.hdxbzkb.2024165
氧化镓单晶的磨削材料去除机理和损伤演化研究
Study on Material Removal Mechanism and Damage Evolution of Monocrystalline Gallium Oxide in Grinding Process
摘要
Abstract
To investigate the material removal mechanism and the subsurface damage evolution of monocrystalline gallium oxide,a systematic study was conducted by experimental methods.Firstly,the variable-depth nano-scratching test was used to simulate the material removal process of single grit and explore the material removal mechanism in the grinding process.Subsequently,the diamond grinding wheels with mesh sizes of SD600,SD1500,and SD5000 were used to carry out the grinding tests on the monocrystalline gallium oxide and to analyze the morphology of the ground surface and the evolution of subsurface damage.Scanning electron microscope and transmission electron microscope were used as the primary means of characterization,and the stress distribution during the scratching process was analyzed with the finite element method.The results indicate that the cross-acting slip band with multi-directions may lead to irregular fracture pits,and the orientation cracks were greatly affected by the(-3-10)plane of the monocrystalline gallium oxide.The grinding experiments reveal that the ground morphology,characterized by a brittle removal surface dominated by fracture pits and orientation cracks,gradually evolved into a completely plastic removal surface with the decrease of mesh sizes.关键词
半导体材料/磨削/氧化镓单晶/纳米划痕/亚表面损伤Key words
semiconductor materials/grinding/monocrystalline gallium oxide/nanoscratch/subsurface damage分类
信息技术与安全科学引用本文复制引用
杨鑫,康仁科,任佳伟,李天润,高尚..氧化镓单晶的磨削材料去除机理和损伤演化研究[J].湖南大学学报（自然科学版）,2024,51(4):10-19,10.基金项目
国家重点研发计划资助项目(2022YFB3605902),National Key Research and Development Program of China(2022YFB3605902) （2022YFB3605902）
国家自然科学基金资助项目(51975091,51991372),National Natural Science Foundation of China(51975091,51991372) （51975091,51991372）
