基于Taguchi-GA协同的磁性磨料抛光性能预测及制备工艺参数寻优OA北大核心CSTPCD
Predicting Polishing Performance of Magnetic Abrasive and Optimizing Its Preparation Process Parameters Based on Taguchi-GA Synergy
通过改变黏结法磁性磨料的制备工艺参数来设计正交试验,制备不同系列规格的磁性磨料,并对其进行形貌和成分检测.以3D打印AlSi10Mg板为加工对象,通过平面磁力研磨试验,揭示磁性磨料制备工艺参数对磁力研磨质量的影响规律.基于回归分析,建立参数与响应之间的回归模型,通过遗传算法实现参数优化.结果表明,在SiC粒径为18～25 µm,Fe与SiC的质量比为4.7,环氧树脂与聚酰胺的质量比为2,固化温度为100℃的条件下,材料去除率为1.7 mg/min,表面粗糙度由原始的3.90 µm降低至0.27 µm,降低率为93.1%.
In this study,an orthogonal experiment was designed by changing the preparation process parameters of bonded magnetic abrasives.Then,a series of magnetic abrasives with different specifications were prepared,and their morphology and composition were detected.Taking the 3D-printed AlSi10Mg plate as the processing object,the influence of the magnetic abrasive preparation process parameters on the polishing quality was revealed through the planar magnetic abrasive finishing experiment.A regression model between parameters and responses was established based on regression analysis,and the genetic algorithm optimized parameters.The results show that under the condition that SiC is 18～25 µm,the mass ratio of Fe to SiC is 4.7,the mass ratio of resin to curing agent is 2,the curing temperature is 100 ℃,the material removal rate is 1.7 mg/min,and the surface roughness is reduced from the original 3.90 µm to 0.27 µm with a reduction of 93.1%.
王燎原;孙玉利;张桂冠;吴鹏飞;易思广;孙业斌;左敦稳
南京航空航天大学 机电学院,江苏 南京 210016山东理工大学 先进制造研究院,山东 淄博 255049
机械工程
优化遗传算法磁性磨料磁力研磨抛光性能
optimizationgenetic algorithmmagnetic abrasivemagnetic abrasive finishingpolishing performance
《湖南大学学报（自然科学版）》 2024 (004)
43-53 / 11
南京航空航天大学博士研究生拔尖创新人才培养"引航计划"跨学科创新基金项目(KXKCXJJ202307),Interdisciplinary Inno-vation Fund for Doctoral Students of Nanjing University of Aeronautics and Astronautics(KXKCXJJ202307);南京航空航天大学研究生创新实验竞赛培育项目,Graduate Innovative Experiment Competition Cultivation Project Fund of Nanjing University of Aeronautics and Astronau-tics;南京航空航天大学博士学位论文创新与创优基金项目(BCXJ22-08),Nanjing University of Aeronautics and Astronautics Doctoral Disser-tation Innovation and Excellence Fund(BCXJ22-08)
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