发光学报2024，Vol.45Issue(3)：506-515,10.DOI:10.37188/CJL.20230318
三维电镀陶瓷基板激光封焊技术
Laser Welding and Packaging Technology of Three-dimensional Direct Plated Copper Ceramic Substrate
摘要
Abstract
Hermetic sealing is a crucial packaging method that promotes the high reliability development of elec-tronic devices.Traditional hermetic packaging technologies have some problems,such as high welding temperatures and thermal shock and limited application ranges,which cannot meet requirements for hermetic packaging of three-dimensional direct plated copper ceramic substrate(3-D DPC).In this study,combining with the technical advan-tages of pulsed laser welding,we investigated the achievement of hermetic packaging of 3-D DPC using pulsed laser welding.The interaction mode between pulsed laser and materials during the welding process was discussed,and the interface microstructure,hermeticity,and mechanical properties of the welding samples were analyzed.The re-search indicates that the formation of cracks in welded metal area is closely related to the diffusion of copper from the base metal to the Kovar side.The heat conduction mode and transition mode with stable welding process and low depth of fusion can avoid the formation of welding cracks.The welding process parameters were optimized through ex-periments.At a peak laser power of 120 W,a pulse width of 1 ms,and an overlap rate of 80%,the three-dimension-al ceramic substrate cavity packaging structure achieved the optimal high hermeticity,with a leakage rate of 5.2×10-10 Pa·m3/s and a joint shear strength of 278.06 MPa,meeting the requirements for high-reliability hermetic pack-aging of third-generation semiconductor devices.关键词
脉冲激光/焊接模式/气密封装/三维电镀铜陶瓷基板(3-D DPC)Key words
pulsed laser/welding mode/hermetic packaging/three-dimensional direct plated copper ceramic sub-strate(3-D DPC)分类
信息技术与安全科学引用本文复制引用
罗霖,丁勇杰,苏鹏飞,赵九洲,彭洋,陈明祥..三维电镀陶瓷基板激光封焊技术[J].发光学报,2024,45(3):506-515,10.基金项目
国家重点研发计划(2022YFB3604803) （2022YFB3604803）
国家自然科学基金(62274069)Supported by National Key Research and Development Program of China(2022YFB3604803) （62274069）
National Natural Science Foun-dation of China(62274069) （62274069）
