低分子量苯乙烯-马来酸酐树脂酯化物的制备与应用OA
Preparation and Application of Low Molecular Weight Styrene-Maleic Anhydride Resin Esterification
采用溶液聚合法合成了多种低分子量苯乙烯-马来酸酐无规共聚物(SMA),然后加入甲基丙烯酸羟乙酯和催化剂,制备了适用于抗蚀抗电镀油墨领域的低成本酯化树脂(SMAH).探究了不同溶剂、不同单体配比和不同温度条件对SMA分子量的影响.通过分子量测试表明,SMA的分子量受体系溶剂种类、单体配比和反应温度的影响,并且制备的树脂的最低分子量可达 6000 g/mol以下.随后,对应用在油墨中自合成SMAH树脂的各项性能测试表明,阻焊油墨SMAH-3 树脂的显影性、附着力和耐热性指标均正常,且其反射率和耐黄变性分别为86.5 和0.36.因此,SMAH-3 树脂可用于制备阻焊油墨.
Firstly,a variety of low molecular weight styryl-maleic anhydride random copolymers(SMA)were synthesized by solution polymerization.Then,by adding hydroxyethyl methacrylate and catalyst,a low-cost esterification resin(SMAH)suitable for corrosion resistant electroplating ink was prepared.The effects of different solvent,monomer ratio and temperature on the molecular weight of SMA were investigated.The molecular weight test showed that the molecular weight of SMA was affected by the type of solvent,monomer ratio and reaction temperature,and the minimum molecular weight of the prepared resin could be below 6000 g/mol.Subsequently,various performance tests on the self-synthesized SMAH resin applied in ink showed that the development,adhesion,and heat resistance indicators of the solder resist ink SMAH-3 resin were normal,and its reflectivity and yellowing resistance were 86.5 and 0.36,respectively.Therefore,SMAH-3 resin could be used to prepare solder resist inks.
刘继强;胡豪豪;张春;李贵东;徐长安;罗啟权;冯逸彬;胡洋;杨卓鸿
广东三求光固材料股份有限公司,广东 佛山,528200华南农业大学,材料与能源学院,生物基材料与能源教育部重点实验室,广东 广州,510642
化学工程
苯乙烯马来酸酐阻焊油墨分子量溶液聚合
styrenemaleic anhydridesolder resist inkmolecular weightsolution polymerization
《广州化学》 2024 (002)
36-40 / 5
广东省科技项目(2023B0101020002,2022A0505050062,2022A1515240079);广东省自然资源厅项目(GDNRC[2021]47);广东省研究生联合培养(佛山)基地扶持项目;顺德区科技项目(2130218003117)
评论