计算机工程与科学2024，Vol.46Issue(4)：599-605,7.DOI:10.3969/j.issn.1007-130X.2024.04.004
面向芯粒间互连的低功耗发射机驱动设计
A low-power transmitter driver for die to die
摘要
Abstract
A low-power transmitter driver for chiplet interconnection was designed and experimental-ly implemented based on the inter-chip interconnection standard proposed by the UCIe protocol.The driver circuit adopts a source series terminated(SST)driver,whose power consumption is only 1/4 that of the current mode logic(CML)structure.In addition,based on adjustable feedforward equalization technology,the driver circuit adjusts the equalization strength for different channel attenuations.By de-emphasizing equalization,it enhances the quality of the transmitted signal,ultimately reducing inter-symbol interference.This circuit was designed under CMOS 28 nm process.The front-end simulation results show that the maximum equalization intensity is-3.7 dB when the 0.9 V voltage is supplied.When the 32 Gbps NRZ signal passes through the 21 mm channel(the attenuation at the 16 GHz Nyquist frequency is-2.37 dB),after adjusting the appropriate equalization intensity,the eye height of the output waveform eye diagram is 253 mV(71.8%),the eye width is 27 ps(87%),and the simula-tion power consumption is only 4.0 mW.关键词
芯粒/前馈均衡器/SST驱动器/高速接口电路/发射机Key words
Chiplet/feedforward equalizer(FFE)/source series terminated(SST)driver/serDes/transmitter分类
信息技术与安全科学引用本文复制引用
任博琳,肖立权,齐星云,张庚,王强,罗章,庞征斌,徐佳庆..面向芯粒间互连的低功耗发射机驱动设计[J].计算机工程与科学,2024,46(4):599-605,7.基金项目
国家重点研发计划(2022YFB4401504) （2022YFB4401504）
