机械科学与技术2024，Vol.43Issue(4)：637-642,6.DOI:10.13433/j.cnki.1003-8728.20220243
碳化硅陶瓷的激光改性磨削
Laser Modified Grinding of Silicon Carbide Ceramics
摘要
Abstract
In order to realize high-precision machining of SiC ceramics,laser irradiation is introduced into the grinding process.In this paper,SiC ceramics as research material,by using laser modified grinding(LMG)process,and then the grinding experiments of SiC ceramics modified by laser irradiation were carried out.Comparing with the ordinary grinding(OG),the grinding force,surface roughness,surface morphology and subsurface damage of SiC ceramic samples were studied.The experimental results show that LMG can effectively reduce normal grinding force,tangential grinding force and surface roughness,and the maximum decreases are 33.91%,37.31%and 33.14%,respectively.LMG promotes the plastic removal of SiC ceramics in the grinding process,and the grinding surface is regular and smooth.There are fewer micro-cracks on the workpiece subsurface,and the subsurface damage depth is small.The plastic removal with a large grinding depth is realized,and the grinding quality of SiC ceramics is improved.关键词
碳化硅陶瓷/激光改性磨削/磨削力/表面质量/塑性去除Key words
silicon carbide ceramics/laser modified grinding/grinding force/surface quality/plastic removal分类
矿业与冶金引用本文复制引用
刘伟,顾浩,唐都波,刘顺..碳化硅陶瓷的激光改性磨削[J].机械科学与技术,2024,43(4):637-642,6.基金项目
国家自然科学基金项目(U23A20634,51505144)、湖南省自然科学基金项目(2023JJ30251,2020JJ5178,2020JJ4024)及湖南省教育厅科学研究项目(20A202) （U23A20634,51505144）
