有色金属科学与工程2024，Vol.15Issue(2)：237-255,19.DOI:10.13264/j.cnki.ysjskx.2024.02.011
增强体表面改性在高导热金属基复合材料中的应用
Application of surface modification of reinforcing phase in metal matrix composites with high thermal conductivity
摘要
Abstract
With the rapid development of electronic technology and the upgrading of electronic devices,the requirement for electronic packaging materials is getting higher than before.Metal matrix composites,especially aluminum and copper matrix composites have the characteristics of high thermal conductivity,low expansion,and high stability,which are electronic packaging materials with broad application prospects.However,diamond,graphene,silicon,and other reinforcements have poor wettability with the matrix,or have harmful interface reaction with the matrix at high temperature,which limits the development and application of metal matrix composites with the high thermal conductivity.This paper briefly described the research progress of interface of metal matrix composites,and proposed several methods to improve the interface bonding based on the factors that affect the interface bonding of metal matrix composites.Surface modification of reinforcement is one of the most important ways to improve the interface of metal matrix composites.The common technologies include magnetron sputtering,chemical vapor deposition,sol-gel and electroless plating.Finally,the application of surface modification of reinforcement in metal matrix composites with high thermal conductivity was analyzed and prospected.关键词
电子封装材料/金属基复合材料/铝基复合材料/铜基复合材料/增强体/界面反应/表面改性Key words
electronic packaging materials/metal matrix composites/aluminum matrix composites/copper matrix composites/reinforcement/interface reaction/surface modification分类
通用工业技术引用本文复制引用
蔡志勇,文璟,王日初,彭超群..增强体表面改性在高导热金属基复合材料中的应用[J].有色金属科学与工程,2024,15(2):237-255,19.基金项目
国家自然科学基金资助项目(52274369) （52274369）
中国博士后科学基金项目(2018M632986) （2018M632986）
湖南省自然科学基金项目(2019JJ50766) （2019JJ50766）
轻质高强结构材料国防重点实验室开放基金资助项目(JCKY201851) （JCKY201851）
